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Smart Phone Stand - TAEKWONDO

SPLA avatarSPLA

April 3, 2015

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Description

No Support, Materials : SPLA filament 1.75 (Heat-resistance PLA filament) Nozzle : 0.2 , infill : 10% extruder temperature : 200 Speed :.70s Size :100% (150 x 92 x, 50 mm)

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