January 25, 2026
Description
3D-printable case model for Orange Pi 4 Pro, designed for PETG or ABS printing. Cooling has been optimized: the design accommodates a heatsink up to 15 mm tall on both the CPU and RAM, and supports forced-air cooling with either a 30×30×10 mm or a 40×40×10 mm fan.
Additionally, the package includes mounting hardware to attach the case to the back of a monitor using VESA 100×100 or VESA 75×75 standards.
Additional materials required for assembly:
License:
BY-NC-SA